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IC Packaging Project Manager

IC Packaging Project Manager (BBBH2814) München (81249), Germany

Salary: EUR80000 - EUR100000 per annum

IC Design and Packaging Project Manager – Package Design Engineer, Integrated Circuits, MEMS

A Packaging Engineer with experience in Design and Project Management is required for a leading multi discipline organisation in Germany

You will be required to interact with multiple levels of management and working with external stakeholders to the highest quality to meet expectations.

You should have a background in Package Engineering and IC Package Design and power/signal integrity modeling for PCB and packages. Experience in a large semiconductor environment essential

Skills:

  • IC Package Design Engineering
  • Signal Integrity and Power Integrity modeling for Packages and PCBs
  • Experience in optical transceiver architectures and standards
  • Analog RF front end circuits

IC Design and Packaging Project Manager – Package Design Engineer, Integrated Circuits, MEMS

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